LMC6064IMSLASHNOPB datasheet(2/22 Pages) TI1

2 / 22 page

LMC6064

SNOS656D – AUGUST 2000 – REVISED MARCH 2013

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Low-Leakage Sample and Hold

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2) (3)

Differential Input Voltage

±Supply Voltage

Voltage at Input/Output Pin

(V+) +0.3V,

(V−)

−0.3V

Supply Voltage (V+

− V−)

16V

Output Short Circuit to V+

See(4)

Output Short Circuit to V−

See(5)

Lead Temperature (Soldering, 10 sec.)

260°C

Storage Temp. Range

−65°C to +150°C

Junction Temperature

150°C

ESD Tolerance(6)

2 kV

Current at Input Pin

±10 mA

Current at Output Pin

±30 mA

Current at Power Supply Pin

40 mA

Power Dissipation

See(7)

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test

conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

For ensured Military Temperature Range parameters see RETSMC6064X.

(4)

Do not connect output to V+, when V+ is greater than 13V or reliability witll be adversely affected.

(5)

Applies to both single-supply and split-supply operation. Continous short circuit operation at elevated ambient temperature can result in

exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of ±30 mA over long term may adversely

affect reliability.

(6)

Human body model, 1.5 k

Ω in series with 100 pF.

(7)

The maximum power dissipation is a function of TJ(Max), θJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(Max) − TA)/θJA.

Operating Ratings

(1)

Temperature Range

LMC6064AM

−55°C ≤ TJ ≤ +125°C

LMC6064AI, LMC6064I

−40°C ≤ TJ ≤ +85°C

Supply Voltage

4.5V

≤ V+ ≤ 15.5V

Thermal Resistance (

θJA)

(2)

14-Pin PDIP

81°C/W

14-Pin SOIC

126°C/W

Power Dissipation

See(3)

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test

conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed.

(2)

All numbers apply for packages soldered directly into a PC board.

(3)

For operating at elevated temperatures the device must be derated based on the thermal resistance

θJA with PD = (TJ–TA)/θJA.

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