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LMC555

SNAS558M – FEBRUARY 2000 – REVISED JULY 2016

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Copyright © 2000–2016, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 4

6.1

Absolute Maximum Ratings ...................................... 4

6.2

ESD Ratings.............................................................. 4

6.3

Recommended Operating Conditions ....................... 4

6.4

Thermal Information ................................................. 4

6.5

Electrical Characteristics........................................... 5

7

Parameter Measurement Information .................. 6

8

Detailed Description .............................................. 7

8.1

Overview ................................................................... 7

8.2

Functional Block Diagram ......................................... 7

8.3

Feature Description................................................... 7

8.4

Device Functional Modes.......................................... 8

9

Application and Implementation ........................ 12

9.1

Application Information............................................ 12

9.2

Typical Application ................................................. 12

9.3

Frequency Divider ................................................... 14

9.4

Pulse Width Modulator ............................................ 14

9.5

Pulse Position Modulator ........................................ 15

9.6

50% Duty Cycle Oscillator ...................................... 16

10

Power Supply Recommendations ..................... 17

11

Layout................................................................... 17

11.1

Layout Guidelines ................................................. 17

11.2

Layout Example .................................................... 17

12

Device and Documentation SupportChanged

layout of National Semiconductor Data Sheet to

TI format................................................................ 18

12.1

Receiving Notification of Documentation Updates 18

12.2

Community Resources.......................................... 18

12.3

Trademarks ........................................................... 18

12.4

Electrostatic Discharge Caution ............................ 18

12.5

Glossary ................................................................ 18

13

Mechanical, Packaging, and Orderable

Information ........................................................... 18

4 Revision History

Changes from Revision L (February 2016) to Revision M

Page

•

Changed order of Features list. ............................................................................................................................................. 1

•

Changed stable to astable - typo. .......................................................................................................................................... 1

•

Changed stable to astable - typo. .......................................................................................................................................... 7

•

Changed beings to begins typo. ............................................................................................................................................. 8

•

Changed typo LM555 to LMC555. ...................................................................................................................................... 12

•

Changed typo LM555 to LMC555. ...................................................................................................................................... 12

•

Added additional applications. ............................................................................................................................................. 14

Changes from Revision K (January 2015) to Revision L

Page

•

Changed typo - temp range from 185 to 85 .......................................................................................................................... 4

Changes from Revision J (March 2013) to Revision K

Page

•

Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional

Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device

and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1

Changes from Revision I (March 2013) to Revision J

Page

•

Changed layout of National Semiconductor Data Sheet to TI format ................................................................................. 18