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LM9070 bảng dữ liệu(PDF) 11 Page - Texas Instruments |
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LM9070 bảng dữ liệu(HTML) 11 Page - Texas Instruments |
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11 / 19 page ![]() LM9070 www.ti.com SNVS130E – DECEMBER 1999 – REVISED APRIL 2013 Figure 23. System Application Circuit and Control Waveforms THERMAL MANAGEMENT The LM9070 is packaged in both a TO-263 surface mount power package and a narrow lead-pitch TO-220 package. To obtain operation over the highest possible load current and input voltage ranges, care must be taken to control the operating temperature of the device. Thermal shutdown protection is built in, with a threshold above 150°C. Conventional heat-sinking techniques can be used with the TO-220 package. When applying the TO-263 package, on board heat-sinking is important to prevent premature thermal shutdown. More copper foil area under the tab of the device will directly improve the operating θJ-A of the TO-263 package, which will reduce the junction temperature of the device. Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Links: LM9070 |
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