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BGS2 bảng dữ liệu(PDF) 1 Page - BeRex Corporation |
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BGS2 bảng dữ liệu(HTML) 1 Page - BeRex Corporation |
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1 / 8 page ![]() 1 Rev. E BeRex ●website: www.berex.com ●email: sales@berex.com Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark of BeRex. All other trademarks are the property of their respective owners. © 2015 BeRex 50-4000 MHz SILICON GERMANIUM Gain Block BGS2 Single Fixed 3V supply No Dropping Resistor Required No matching circuit needed Lead-free/Green/RoHS compliant SOT-363 package Application: Driver Amplifier, Cellular, PCS, GSM, UMTS, WCDMA, Wireless Data BeRex’s BGS2 is a high SiGe HBT MMIC am- plifier, internally matched to 50 Ohms with- out the need for external components. De- signed to run directly from a 3V supply. The BGS2 is designed for high linearity 3V gain block applications . It is packaged in a RoHS- compliant with SOT-363 surface mount package. Product Description Device Features Driver Amplifier Cellular, PCS, GSM, UMTS, WCDMA Applications Applications Circuit *C1, C2, C3 =100 pF ± 5%; C4 = 1000 pF ± 5%; C5 = 10uF; **L1 = 56nH 1 Device performance _ measured on a BeRex evaluation board at 25°C, 50 Ω system. 2 OIP3 _ measured with two tones at an output of 0 dBm per tone separated by 1 MHz. Typical Performance 1 Absolute Maximum Ratings Min. Typical Max. Unit Bandwidth 70 4000 MHz IC @ (Vc = 3V) 30 34 38 mA VC 3.0 V dG/dT -0.005 dB/°C RTH 130 °C/W Parameter Unit Rating Operating Case Temperature °C -40 to +85 Storage Temperature °C -55 to +155 Junction Temperature °C +150 Operating Voltage V +3.8 Supply Current mA 100 Input RF Power dBm 15 Operation of this device above any of these parameters may result in permanent damage. **less than 56nH improves RF performance at over 0.9GHz. *1uH or higher value L1 improves RF performance at under 900MHz. *Optimum value of L1 may vary with board design. BGS2 L1 C1 C3 C4 RFin RFout C5 +3V C2 *C1,C2=2000pF, L1=1uH for 70MHz application, BS2 X IN GND GND OUT GND GND Pin Description RF IN 3 RF OUT 6 GND 1,2,4,5 Part Marking (X: Wafer number) Parameter Frequency Unit 70 900 1900 2450 2650 3500 MHz Gain 26.5 23.6 19.8 18.1 17.2 15 dB S11 -19.6 -18.3 -18.6 -18.4 -17.6 -13.7 dB S22 -15.6 -12.8 -9.9 -10.5 -13.2 -15.7 dB OIP3 2 28 25.5 24.5 22.5 25 19.2 dBm P1dB 15.6 13.4 12.8 10.8 10.4 8.7 dBm N.F 2.7 2.3 2.2 2.3 2.5 2.7 dB Application Circuit Values Example Freq. 70~900MHz 900MHz ~ 3GHz 3GHz ~ 4GHz C1/C2 2nF 100pF 100pF L1 1uH 56nH 27nH (1608 Chip Ind.) *C1,C2=100pF, L1=27nH for 3.5GHz application. |
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Mô tả tương tự - BGS2 |
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