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DP8459 bảng dữ liệu(PDF) 27 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
tên linh kiện DP8459
Giải thích chi tiết về linh kiện  All-Code Data Synchronizer
PDF  35 Pages
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nhà sản xuất  NSC [National Semiconductor (TI)]
Trang chủ  http://www.national.com
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5.0 Multiple Data Rate Applications
The DP8459 may be rapidly and easily switched from one data
rate to another, conceivably from its highest to its lowest
specified data rate and vice versa, with a minimum of
adaptation effort. This capacity facilitates the employment of
the DP8459 for stepped data rate disk applications (constant
density recording, or CDR), or for the employment of a single
data synchronizer for multiple-media controllers as a cost and
space conserving measure, e.g., allowing a controller to
address tape, floppy disk and hard disk read channels on a
multiplexed basis while employing a single data separator.
DP8459 data rate changes require only the appropriate new
REFERENCE
CLOCK
frequency
be
applied
and
the
necessary new RANGE SELECT information be presented to
the chip in cases where the Customer chooses to employ
compromise loop and Timing Extractor filters. The Customer
may alternatively choose to employ a transmission gate
technique to multiplex between appropriate filter elements for
various operating data rates should the frequencies be
sufficiently different (e.g., streaming tape drive versus hard
disk drive).
6.0 PC Board Layout Recommendations
The DP8459 data synchronizer circuit has been designed to
minimize the sensitivities normally associated with phase
locked loops which operate within digital environments, and in
particular those within disk and tape memory systems. A list of
recommendations and precautions is made available here for
the Customer, however, such that the DP8459 environment
can be optimized and the best possible performance achieved
with the device.
1. A localized V
CC supply net or island should be established
for the device and all its associated passive components,
supplied by but separated from the main V
CC plane. The
local V
CC net should be tied to the main VCC plane at only
one point and bypassed to the ground plane at that point.
2. The DP8459 V
CC
pins should be bypassed to ground
through the shortest electrical path possible between the
supply pins the ground pins themselves. Bypassing should
be achieved with a 0.1 µF ceramic capacitor in parallel with
a 1000 pF silver mica capacitor.
3. The main digital ground plane should be used for all
grounding associated with the device. Both Analog and
Digital ground pins should be tied to this plane.
4. All passive components associated with the DP8459
should be located as close to their respective device pins
as possible. Lead length should be minimized.
5. External passive components should be oriented so as to
minimize the length of the ground-return path between the
component’s ground plane tie point and the DP8459 Analog
ground pin.
6. In order to minimize pin parasitic capacitances, planing
(supply or ground) should not be placed between device pin
eyelets.
7. Digital signal lines should not be run adjacent to external
passive analog components associated with the device.
Digital signal lines should not be run between analog signal
pins or traces associated with the device.
8. Digital input noise experience by the device should be
minimized, i.e., it may be advisable to condition input
waveforms in order to reduce transient noise. This may be
done with a series damping resistor at the REFERENCE
CLOCK input (and perhaps at the ENCODED READ DATA
input) in high frequency systems. This would terminate
board
traces
and
thus
prevent
under-damped,
noise-producing switching transients at the device inputs.
9. Digital output loading should be minimized, i.e., if outputs
must drive large loads or long traces, employ buffering.
Pre-termination of PC traces driven by the SYNCHRO-
NIZED CLOCK and SYNC DATA outputs may be advisable
in high frequency systems (i.e., include series resistance
equivalent to the characteristic impedance of the PC board
trace).
10. All unused digital output pins should be allowed to float,
unconnected to any trace.
11. The device should not be located in a region of the PC
board where large V
CC
or ground plane currents are
Original Window Position
TL/F/9322-2
Early Strobe Window Position
TL/F/9322-3
Late Strobe Window Position
TL/F/9322-4
De-Skewed Window Position
TL/F/9322-5
http:\\www.national.com
27
PrintDate=1996/07/31 PrintTime=11:06:13 ds009322 Rev. No. 1
Proof
27



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