LM3528TMXSLASHNOPB datasheet(3/34 Pages) TI1

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LM3528

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SNVS513B – AUGUST 2008 – REVISED MAY 2013

Absolute Maximum Ratings

(1) (2) (3)

VIN

−0.3V to 6V

VSW, VOVP,

−0.3V to 25V

VSUB/FB, VMAIN

−0.3V to 23V

VSCL, VSDA, VRESET\GPIO, VIO , VSET

−0.3V to 6V

Continuous Power Dissipation

Internally Limited

Junction Temperature (TJ-MAX)

+150°C

Storage Temperature Range

-65°C to +150°C

Maximum Lead Temperature (Soldering, 10s)(4)

+300°C

ESD Rating(5)

Human Body Model

2.5kV

(1)

Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the

device is intended to be functional, but device parameter specifications may not be ensured. For ensured specifications and test

conditions, see the Electrical Characteristics.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(3)

All voltages are with respect to the potential at the GND pin.

(4)

For detailed soldering specifications and information, please refer to Texas Instruments Application Note 1112: DSBGA Wafer LEvel

Chip Scale Package (SNVA009).

(5)

The human body model is a 100pF capacitor discharged through 1.5k

Ω resistor into each pin. (MIL-STD-883 3015.7).

Operating Ratings

(1) (2)

VIN

2.5V to 5.5V

VSW, VOVP,

0V to 23V

VSUB/FB, VMAIN

0V to 21V

Junction Temperature Range (TJ)

(3)

-40°C to +110°C

Ambient Temperature Range (TA)

(4)

-40°C to +85°C

(1)

Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the

device is intended to be functional, but device parameter specifications may not be ensured. For ensured specifications and test

conditions, see the Electrical Characteristics.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=+150°C (typ.) and

disengages at TJ=+140°C (typ.).

(4)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP

= +105°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of

the part/package in the application (

θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).

Thermal Properties

Junction to Ambient Thermal Resistance (

θJA)

(1)

68°C/W

(1)

Junction-to-ambient thermal resistance (

θJA) is taken from a thermal modeling result, performed under the conditions and guidelines set

forth in the JEDEC standard JESD51-7. The test board is a 4-layer FR-4 board measuring 114.3mm x 76.2mm x 1.6mm. The ground

plane on the board is 113mm x 75mm. Thickness of copper layers are 71.5µm/35µm/35µm/71.5µm (2oz/1oz/1oz/2oz). Ambient

temperature in simulation is 22°C, still air. Power dissipation is 1W. For more information on these topics, please refer to Texas

Instruments Application Note 1112 SNVA009, and JEDEC Standard JESD51-7.

Electrical Characteristics

Specifications in standard type face are for TA = 25°C and those in boldface type apply over the Operating Temperature

Range of TA = −40°C to +85°C. Unless otherwise specified VIN = 3.6V, VIO = 1.8V, VRESET/GPIO = VIN, VSUB/FB = VMAIN = 0.5V,

SET

= 12.0k

Ω, OLED = ‘0’, ENM = ENS = ‘1’, BSUB = BMAIN = Full Scale.

(1) (2)

Symbol

Parameter

Conditions

Min

Typ

Max

Units

ILED

Output Current Regulation

UNI = ‘0’, or ‘1’,

18.5

MAIN or SUB/FB Enabled

2.5V < VIN < 5.5V

Maximum Current Per

RSET = 8.0kΩ

Current Sink

(1)

All voltages are with respect to the potential at the GND pin.

(2)

Min and Max limits are ensured by design, test, or statistical analysis. Typical (Typ) numbers are not ensured, but represent the most

likely norm.

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