b

12V

Package Power Rating at 25 C

35 Watts

(PC Board Mounted)

See Section 5

Derate linearly at the rate of 286 mW C

Input Voltage

Storage Temperature

b

65 to 150 C

Lead Temp (Soldering 10 seconds)

260 C

For actual power dissipation of the device please refer to section 70

Recommended Operating

Conditions

b

Ambient Temperature

0 to 70 C

If MilitaryAerospace specified devices are required

please contact the National Semiconductor Sales

OfficeDistributors for availability and specifications

Symbol

Parameter

Min

Typ

Max

Units

b

85

b

130

mA

b

125

b

180

mA

Receive input bias current (RXI)

b

2

a

25

m

A

Transmit output dc current level (TXO)

37

41

45

mA

Transmit output ac current level (TXO)

g

28

mA

Collision threshold (Receive mode)

b

145

b

153

b

158

V

g

550

g

1200

mV

b

15

b

20

b

25

V

g

40

mV

b

175

b

225

b

300

mV

Input capacitance (RXI)

12

pF

Shunt resistancenon transmitting (RXI)

100

KX

Shunt resistancetransmitting (TXO)

10

KX

Symbol

Parameter

Min

Typ

Max

Units

b

85

b

130

mA

b

125

b

180

mA

Receive input bias current (RXI)

b

2

a

25

m

A

Transmit output dc current level (TXO)

37

41

45

mA

Transmit output ac current level (TXO)

g

28

mA

Collision threshold (Receive mode)

b

145

b

153

b

158

V

g

550

g

1200

mV

b

15

b

20

b

25

V

g

40

mV

b

175

b

225

b

275

mV

Input capacitance (RXI)

12

pF

Shunt resistancenon transmitting (RXI)

100

KX

Shunt resistancetransmitting (TXO)

75K

10

KX

Note 1

Absolute maximum ratings are those values beyond which the safety of the device cannot be guaranteed They are not meant to imply that the device

should be operated at these limits

Note 2

All currents into device pins are positive all currents out of device pins are negative All voltages referenced to ground unless otherwise specified

Note 3

7