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PACKAGE OUTLINE

C

SEE TERMINAL

DETAIL

28X

0.3

0.2

2±0.1

28X

0.5

0.3

0.8 MAX

(0.2) TYP

0.05

0.00

24X 0.5

2X

4.5

4±0.1

2X 1.5

A

3.6

3.4

B

5.6

5.4

0.3

0.2

0.5

0.3

WQFN - 0.8 mm max height

RHR0028A

PLASTIC QUAD FLATPACK - NO LEAD

4219075/A 11/2014

PIN 1 INDEX AREA

0.08

SEATING PLANE

1

10

15

24

11

14

28

25

(OPTIONAL)

PIN 1 ID

0.1

C A

B

0.05

EXPOSED

THERMAL PAD

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 2.700

DETAIL

OPTIONAL TERMINAL

TYPICAL

27

HD3SS460

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SLLSEM7B – JANUARY 2015 – REVISED JUNE 2016

Product Folder Links: HD3SS460

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