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DP83861 bảng dữ liệu(PDF) 21 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
tên linh kiện DP83861
Giải thích chi tiết về linh kiện  Gig PHYTER 10/100/1000 Ethernet Physical Layer
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In general, using pull-up and pull-down resistors instead of
tying unused inputs directly to VCC or ground has the fol-
lowing disadvantages:
— Additional cost of components
— Additional board area. (May prevent fitting into fewer lay-
ers of PCB, having components only on the top side, or
fitting into small profile cards.)
— Reliability problems (Due to bad solder joints, etc.)
— Need to test components: Might necessitate additional
vias to be drilled to have test points on the back side, for
in circuit test. This adds to PCB manufacturing time, and
cost. Also testing additional components add to in circuit
test duration, and makes the test program longer to
write.
— Inventory costs for the additional components
3.7 Hardware Reset
RESET pin 164 which is active low should be held low for a
minimum of 140
µs to allow hardware reset. During hard-
ware reset the strap option pins are re-latched, and register
and state machines are reset. For timing details see
Figure 5.7. There is no on-chip internal power-on reset and
the DP83861 requires an external reset signal be applied
to the RESET pin.
3.8 Temperature Considerations
The DP83861 utilizes an enhanced 208 PQFP package
that eliminates the need for heatsinks. The package has a
built in copper heat slug at the top of the package which
provides a very efficient method of removing heat from the
die through convection. Since the heat slug is on the top of
the package the PCB board stays cooler. The enhance
package has a low Theta Junction to Case of 2.13 oC/W
and a Theta Junction to Ambient of 11.7 oC/W.
For reliability purposes the die temperature of the DP83861
should be kept below 120 oC, this translates to a package
case temperature of 112 oC. For more information on how
this calculation is done see Section 8.15 (Frequently Asked
Questions)
3.9 Pin List and Connections
Table 14 provides pin listings and their connections. This
list should be used to make sure all pin connections are
correct.
Table 9. Magnetic Requirements
Parameter
Min.
Typ.
Max.
Units
Conditions
Turns Ratio
-
1:1
-
-
+/- 2%
Insertion Loss
0.0
-
1.1
dB
0.1 - 1 MHz
-
-
0.5
dB
1.0 - 60 MHz
-
-
1.0
dB
60 - 100 MHz
-
-
1.2
dB
100 - 125 MHz
Return Loss
-18
-
-
dB
1.0 - 30 MHz
-14.4
-
-
dB
30 - 40 MHz
-13.1
-
-
dB
40 - 50 MHz
-12.0
-
-
dB
50 - 80 MHz
-10.0
-
-
dB
80 - 100 MHz
Differential to Common Mode Rejection
-43.0
-
-
dB
1.0 - 30 MHz
-37.0
-
-
dB
30 - 60 MHz
-33.0
-
-
dB
60 - 100 MHz
Cross Talk
-45.0
-
-
dB
1.0 - 30 MHz
-40.0
-
-
dB
30 - 60 MHz
-35.0
-
-
dB
60 - 100 MHz
Isolation
1500
-
-
V
-
Rise Time
-
1.6
1.8
ns
10 - 90%
Primary Inductance
350
-
-
µH-



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