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DP83861 bảng dữ liệu(PDF) 21 Page - National Semiconductor (TI) |
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DP83861 bảng dữ liệu(HTML) 21 Page - National Semiconductor (TI) |
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21 / 88 page ![]() 21 www.national.com In general, using pull-up and pull-down resistors instead of tying unused inputs directly to VCC or ground has the fol- lowing disadvantages: — Additional cost of components — Additional board area. (May prevent fitting into fewer lay- ers of PCB, having components only on the top side, or fitting into small profile cards.) — Reliability problems (Due to bad solder joints, etc.) — Need to test components: Might necessitate additional vias to be drilled to have test points on the back side, for in circuit test. This adds to PCB manufacturing time, and cost. Also testing additional components add to in circuit test duration, and makes the test program longer to write. — Inventory costs for the additional components 3.7 Hardware Reset RESET pin 164 which is active low should be held low for a minimum of 140 µs to allow hardware reset. During hard- ware reset the strap option pins are re-latched, and register and state machines are reset. For timing details see Figure 5.7. There is no on-chip internal power-on reset and the DP83861 requires an external reset signal be applied to the RESET pin. 3.8 Temperature Considerations The DP83861 utilizes an enhanced 208 PQFP package that eliminates the need for heatsinks. The package has a built in copper heat slug at the top of the package which provides a very efficient method of removing heat from the die through convection. Since the heat slug is on the top of the package the PCB board stays cooler. The enhance package has a low Theta Junction to Case of 2.13 oC/W and a Theta Junction to Ambient of 11.7 oC/W. For reliability purposes the die temperature of the DP83861 should be kept below 120 oC, this translates to a package case temperature of 112 oC. For more information on how this calculation is done see Section 8.15 (Frequently Asked Questions) 3.9 Pin List and Connections Table 14 provides pin listings and their connections. This list should be used to make sure all pin connections are correct. Table 9. Magnetic Requirements Parameter Min. Typ. Max. Units Conditions Turns Ratio - 1:1 - - +/- 2% Insertion Loss 0.0 - 1.1 dB 0.1 - 1 MHz - - 0.5 dB 1.0 - 60 MHz - - 1.0 dB 60 - 100 MHz - - 1.2 dB 100 - 125 MHz Return Loss -18 - - dB 1.0 - 30 MHz -14.4 - - dB 30 - 40 MHz -13.1 - - dB 40 - 50 MHz -12.0 - - dB 50 - 80 MHz -10.0 - - dB 80 - 100 MHz Differential to Common Mode Rejection -43.0 - - dB 1.0 - 30 MHz -37.0 - - dB 30 - 60 MHz -33.0 - - dB 60 - 100 MHz Cross Talk -45.0 - - dB 1.0 - 30 MHz -40.0 - - dB 30 - 60 MHz -35.0 - - dB 60 - 100 MHz Isolation 1500 - - V - Rise Time - 1.6 1.8 ns 10 - 90% Primary Inductance 350 - - µH- |
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