CD74FCT653 datasheet(3/11 Pages) TI1

3 / 11 page

CD74FCT543

BiCMOS OCTAL REGISTERED TRANSCEIVER

WITH 3-STATE OUTPUTS

SCBS742 – JULY 2000

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

logic diagram (positive logic)

OEBA

CEBA

LEBA

OEAB

CEAB

LEAB

To Seven Other Channels

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†

DC supply voltage range, VCC

–0.5 V to 6 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DC input clamp current, IIK (VI < –0.5 V)

–20 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DC output clamp current, IOK (VO < –0.5 V)

–50 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DC output sink current per output pin, IOL

70 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DC output source current per output pin, IOH

–30 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous current through VCC, ICC

140 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous current through GND

528 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package thermal impedance,

θJA (see Note 1): EN package

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

M package

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

SM package

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Storage temperature range, Tstg

–65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTE 1: The package thermal impedance is calculated in accordance with JESD 51.

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