CD74FCT574 datasheet(2/11 Pages) TI1

2 / 11 page

CD74FCT574

BiCMOS OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOP

WITH 3-STATE OUTPUTS

SCBS745 – JULY 2000

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

logic symbol†

CLK

† This symbol is in accordance with ANSI/IEEE Std 91-1984 and

IEC Publication 617-12.

logic diagram (positive logic)

CLK

To Seven Other Channels

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡

DC supply voltage range, VCC

–0.5 V to 6 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DC input clamp current, IIK (VI < –0.5 V)

–20 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DC output clamp current, IOK (VO < –0.5 V)

–50 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DC output sink current per output pin, IOL

70 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DC output source current per output pin, IOH

–30 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous current through VCC, ICC

140 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous current through GND

400 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package thermal impedance,

θJA (see Note 1): E package

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

M package

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

SM package

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Storage temperature range, Tstg

–65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTE 1: The package thermal impedance is calculated in accordance with JESD 51.

recommended operating conditions (see Note 2)

MIN

MAX

UNIT

VCC

Supply voltage

4.75

5.25

VIH

High-level input voltage

VIL

Low-level input voltage

0.8

Input voltage

VCC

Output voltage

VCC

IOH

High-level output current

–15

IOL

Low-level output current

∆t/∆v

Input transition rise or fall rate

ns/V

Operating free-air temperature

°C

NOTE 2: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

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