ADS5521IPAPRG4 datasheet(30/36 Pages) TI1

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ADS5521

SBAS309D – MAY 2004 – REVISED OCTOBER 2008 ...................................................................................................................................................... www.ti.com

For more detailed information regarding the PowerPAD package and its thermal properties, see either the

application brief SLMA004B (PowerPAD Made Easy) or technical brief SLMA002 (PowerPAD Thermally

Enhanced Package).

Table 10. Revision History

Added notes regarding the input voltage overstress requirements in the absolute maximum ratings table.

Changed offset temperature coefficient to units of mV/°C.

Clarified output capture test modes in Table 3.

Updated the definitions section.

Updated the Power Down section to reflect the newly specified 2 MSPS minimum sampling rate.

Added footnotes in the Pin Assignements table or pins RESET,OE, SEN, SDATA and SCLK pins.

Removed the input voltage stress section in the Application Information section.

Tpdi parameter was added to the timing Table 8 and Table 9.

Added note in the Serial Programming section about mandatory RESET.

Added latency specification in the Timing Characteristics table.

Rev C

Added min/max specs for Offset and Gain errors.

Rev D

Output Information Section, p. 27.

Changed - From: binary output format and 0x4FFF To: binary output format and 0x7FF.

Changed From: binary output format and 0x2000 To: binary output format and 0x800.

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