4

ADCS7476, ADCS7477, ADCS7478

SNAS192G – APRIL 2003 – REVISED MAY 2016

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Product Folder Links: ADCS7476 ADCS7477 ADCS7478

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Copyright © 2003–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

–0.3

6.5

V

Voltage on any analog pin to GND

–0.3

V

Voltage on any digital pin to GND

–0.3

6.5

V

Input current at any pin (except power supply pins)

±10

mA

Soldering temperature, infrared (10 sec)

215

°C

150

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±3500

V

±200

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage

2.7

5.25

V

Digital input pins voltage (independent of supply voltage)

2.7

5.25

V

Operating temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

ADCS7476,

ADCS7477,

ADCS7478

UNIT

DBV (SOT-23)

6 PINS

Junction-to-ambient thermal resistance

184.5

°C/W

Junction-to-case (top) thermal resistance

151.2

°C/W

Junction-to-board thermal resistance

29.7

°C/W

Junction-to-top characterization parameter

29.8

°C/W

Junction-to-board characterization parameter

29.1

°C/W