12

www.ixysic.com

R03

IX2113

3.5 Mechanical Dimensions

3.5.1 IX2113B: 16-Pin SOIC Package

3.5.2 IX2113BTR: Tape & Reel Packaging for 16-Pin SOIC Package

(inches)

mm

DIMENSIONS

NOTES:

1. Coplanarity = 0.1016 (0.004) max.

2. Leadframe thickness does not include solder plating (1000 microinch maximum).

0.406 ± 0.076

(0.016 ± 0.003)

10.211 ± 0.254

(0.402 ± 0.010)

7.493 ± 0.127

(0.295 ± 0.005)

10.312 ± 0.381

(0.406 ± 0.015)

1.270 TYP

(0.050 TYP)

0.254 / +0.051 / -0.025

(0.010 / +0.002 / -0.001)

0.889 ± 0.178

(0.035 ± 0.007)

0.649 ± 0.102

(0.026 ± 0.004)

PIN 1

PIN 16

2.337 ± 0.051

(0.092 ± 0.002)

0.203 ± 0.102

(0.008 ± 0.004)

45º

2.00

(0.079)

1.27

(0.050)

9.40

(0.370)

0.60

(0.024)

Recommended PCB Land Pattern

Dimensions

mm

(inches)

Embossment

Embossed Carrier

Top Cover

Tape Thickness

0.102 MAX.

(0.004 MAX.)

330.2 DIA.

(13.00 DIA.)

K

(0.126)

K

(0.106)

A

(0.429)

W=16

(0.630)

B

(0.421)

P=12.00

(0.472)

NOTES:

1. All dimensions carry tolerances of EIA Standard 481-2

2. The tape complies with all “Notes” for constant dimensions

listed on page 5 of EIA-481-2