M655 datasheet(4/6 Pages) ICST

4 / 6 page

M655 Series

Performance Specifications

Integrated Circuit Systems

Integrated Circuit Systems, Inc.

Communications Modules

www.icst.com/Comm-Modules

tel: 508-852-5400

Micro Networks has subjected their VCSO component

to various reflow profiles and test conditions for

optimum substrate mounting performance. The

conditions suggested here are recommended

temperature settings for the VCSO device during the

reflow processes. The best case condition for the

device is a slow ramp up to prevent thermal shock

before reaching reflow temperatures of Sn/Pb flux

activated solder with a melting point of 183 degree

Celsius. The M655 device should not see

temperatures above 183 degrees Celsius for an

extended periods beyond 60 seconds. Maximum

peak temperature for the device should not exceed

220 degrees Celsius for longer then 20 seconds.

Micro Networks has designed the M655 device as a

sealed unit. The package is 100% tested for seal

defects. Aqueous, solvent, or other wash type

cleaning methods is acceptable for this device.

IR REFLOW PROFILE

TAPE & REEL

180

220

150

100

60–90

105–150

Time (seconds)

IR Reflow Profile

(Vendor Recommendation)

TAPE

REEL

A24F

1.78

11.5

1.5

100

E12

9.2

14.5

330

3.7

No. per Reel: 300 Max

TAPE & REEL DIMENSIONS

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