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LP3853 bảng dữ liệu(PDF) 15 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor. Click here to check the latest version.
tên linh kiện LP3853
Giải thích chi tiết về linh kiện  3A Fast Response Ultra Low Dropout Linear Regulators
PDF  18 Pages
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nhà sản xuất  NSC [National Semiconductor (TI)]
Trang chủ  http://www.national.com
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LP3853 bảng dữ liệu(HTML) 15 Page - National Semiconductor (TI)

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Application Hints (Continued)
HEATSINKING TO-263 PACKAGE
The TO-263 package uses the copper plane on the PCB as
a heatsink. The tab of these packages are soldered to the
copper plane for heat sinking. Figure 5 shows a curve for the
θ
JA of TO-263 package for different copper area sizes, using
a typical PCB with 1 ounce copper and no solder mask over
the copper area for heat sinking.
As shown in the figure, increasing the copper area beyond 1
square inch produces very little improvement. The minimum
value for
θ
JA for the TO-263 package mounted to a PCB is
32˚C/W.
Figure 6 shows the maximum allowable power dissipation
for TO-263 packages for different ambient temperatures,
assuming
θ
JA is 35˚C/W and the maximum junction tempera-
ture is 125˚C.
20030932
FIGURE 5.
θ
JA vs Copper (1 Ounce) Area for TO-263
package
20030933
FIGURE 6. Maximum power dissipation vs ambient
temperature for TO-263 package
www.national.com
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