Data Sheet

HMC8038

Rev. A | Page 11 of 11

OUTLINE DIMENSIONS

4.10

4.00 SQ

3.90

0.39

0.33

0.27

2.55

2.40 SQ

2.25

1

0.65

BSC

BOTTOM VIEW

TOP VIEW

16

5

8

9

12

13

4

EXPOSED

PAD

PIN 1

INDICATOR

(0.30)

0.70

0.60

0.50

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

0.20 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

1.00

0.90

0.80

COMPLIANT TO JEDEC STANDARDS MO-220-VGGC

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

1.95 REF

Figure 19. 16-Lead Lead Frame Chip Scale Package [LFCSP]

4 mm × 4 mm Body and 0.90 mm Package Height

(CP-16-40)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

HMC8038LP4CE

−40°C to +105°C

MSL3

16-lead Lead Frame Chip Scale Package [LFCSP]

CP-16-40

XXXX

8038

HMC8038LP4CETR

−40°C to +105°C

MSL3

16-lead Lead Frame Chip Scale Package [LFCSP]

CP-16-40

XXXX

8038

EV1HMC8038LP4C

−40°C to +105°C

Evaluation Board

1

RoHs-Compliant Part.

2

The maximum peak reflow temperature is 260°C.

3

4-digit lot number: XXXX.

©2015 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D13554-0-11/15(A)