MCP8024 datasheet(17/46 Pages) MICROCHIP

17 / 46 page

 2013 Microchip Technology Inc.

DS20005228A-page 17

MCP8024

3.15

LA, LB, LC

Low-side N-channel MOSFET drive signal. Connect to

the gate of the external MOSFETs. A low-impedance

resistor may be used between these pins and the

MOSFET gates to limit current and slew rate.

3.16

HA, HB, HC

High-side N-channel MOSFET drive signal. Connect to

the gate of the external MOSFETs. A low-impedance

resistor may be used between these pins and the

MOSFET gates to limit current and slew rate.

3.17

PHA, PHB, PHC

Phase signals from motor. Provides high-side N-

channel MOSFET driver reference and Back EMF

sense input. The phase signals are also used with the

bootstrap capacitors to provide high-side gate drive via

the VBx inputs.

3.18

VBA, VBB, VBC

High-side MOSFET driver bias. Connect these pins

between the bootstrap charge pump diode cathode and

bootstrap charge pump capacitor. The 12V LDO output

is used to provide 12V at the diode anodes. The phase

signals are connected to the other side of the bootstrap

charge pump capacitors.

3.19

DE2

Open-drain

communications

node.

The

DE2

communications is a half-duplex 9600 baud, 8-bit, no

parity communications link. The open-drain DE2 pin

must be pulled high by an external pull-up resistor.

3.20

HV_IN1, HV_IN2,

LV_OUT1,LV_OUT2

Unidirectional digital level translators. Translates digital

input signal on the HV_INx pin to a low-level digital out-

put signal on the LV_OUTx pin. The HV_INx pins have

internal 30K

 pullups to VDD that are controlled by

Configuration register 0 bit 6. The Configuration regis-

ter 0 bit 6 is only sampled during CE = 0. The HV_IN1

pin has higher ESD protection than the HV_IN2 pin.

The higher ESD protection makes the HV_IN1 pin bet-

ter suited for connection to external switches.

LV_OUT1 and LV_OUT2 are open-drain outputs. An

external pull-up resistor to the low-voltage logic supply

is required.

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