TSL1401CCS datasheet(21/29 Pages) AMSCO

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ams Datasheet

Page 21

[v1-00] 2016-Jan-18

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TSL1401CCS − Manufacturing Information

This product, in the solder bump linear array package, has been

tested and has demonstrated an ability to be reflow soldered

to a PCB substrate. The process, equipment, and materials used

in these tests are detailed below.

Tooling Required

• Solder stencil (round aperture size 0.36mm, stencil

thickness of 152.4μm)

• 20 × 20 frame for solder stencil

Process

Apply solder paste using stencil

Dispense adhesive dots

Place component

Reflow solder/cure

X-Ray verify

Placement of the TSL1401CCS device onto the gold immersion

substrate is accomplished using a standard surface mount

manufacturing process. First, using the stencil with 0.36mm

square aperture, print solder paste onto the substrate. Next,

dispense two 0.25mm to 0.4mm diameter dots of adhesive in

opposing corners of the TSL1401CCS mounting area. Machine

place the TSL1401CCS onto the substrate. A suggested pick-up

tool is the Siemens Vacuum Pickup tool nozzle number 912. This

nozzle has a rubber tip with a diameter of approximately

0.75mm. The part is picked up from the center of the body.

Reflow the solder and cure the adhesive using the solder profile

shown in Figure 24.

The reflow profiles specified here describe expected maximum

heat exposure of components during the solder reflow process

of product on a PWB. Temperature is measured at the top of

component. The components should be limited to one pass

through the solder reflow profile used.

Manufacturing Information

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