MICROWAVE CORPORATION

10 - 132

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

10

Output Voltage Waveform,

Pin= 0 dBm, Fout= 882 MHz, T= 25 °C

SMT GaAs HBT MMIC

DIVIDE-BY-8, DC - 18 GHz

HMC494LP3

Absolute Maximum Ratings

Outline Drawing

Typical Supply Current vs. Vcc

Note: Divider will operate over full voltage range shown above

v01.0604

RF Input (Vcc = +5V)

+13 dBm

Supply Voltage (Vcc1, Vcc2)

+5.5V

Channel Temperature (Tc)

135 °C

Continuous Pdiss (T = 85 °C)

(derate 11.9 mW/° C above 85 °C)

593 mW

Thermal Resistance (R

(junction to ground paddle)

84 °C/W

Storage Temperature

-65 to +150 °C

Operating Temperature

-40 to +85 °C

NOTES:

1. MATERIAL PACKAGE BODY: LOW STRESS INJECTION MOLDED

PLASTIC SILICA AND SILICON IMPREGNATED.

2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY

3. LEAD AND GROUND PADDLE PLATING: Sn/Pb SOLDER

4. DIMENSIONS ARE IN INCHES [MILLIMETERS].

5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE

6. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.

PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.

7. PACKAGE WARP SHALL NOT EXCEED 0.05mm.

8. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED

TO PCB RF GROUND.

9. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB

LAND PATTERN.

Vcc1, Vcc2 (V)

Icc (mA)

4.75

90

5.0

103

5.25

115

-500

-400

-300

-200

-100

0

100

200

300

400

500

22.7 22.9 23.1 23.3 23.5 23.7 23.9 24.1 24.3 24.5 24.7

TIME (nS)