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HMC443LP4 bảng dữ liệu(PDF) 4 Page - Hittite Microwave Corporation

tên linh kiện HMC443LP4
Giải thích chi tiết về linh kiện  SMT GaAs HBT MMIC x4 ACTIVE FREQUENCY MULTIPLIER, 9.8 - 11.2 GHz OUTPUT
PDF  6 Pages
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nhà sản xuất  HITTITE [Hittite Microwave Corporation]
Trang chủ  http://www.hittite.com
Logo HITTITE - Hittite Microwave Corporation

HMC443LP4 bảng dữ liệu(HTML) 4 Page - Hittite Microwave Corporation

  HMC443LP4 Datasheet HTML 1Page - Hittite Microwave Corporation HMC443LP4 Datasheet HTML 2Page - Hittite Microwave Corporation HMC443LP4 Datasheet HTML 3Page - Hittite Microwave Corporation HMC443LP4 Datasheet HTML 4Page - Hittite Microwave Corporation HMC443LP4 Datasheet HTML 5Page - Hittite Microwave Corporation HMC443LP4 Datasheet HTML 6Page - Hittite Microwave Corporation  
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MICROWAVE CORPORATION
11 - 55
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
11
HMC443LP4
v01.0604
Absolute Maximum Ratings
Pin Locations & Outline Drawing
Typical Supply Current vs. Vcc
Vcc (V)
Icc (mA)
4.5
51
5.0
52
5.5
54
RF Input (Vcc= +5V)
+20 dBm
Vcc
+6.0V
Storage Temperature
-65 to +150 °C
Operating Temperature
-40 to +85 °C
Note: Multiplier will operate over full voltage range
shown above.
SMT GaAs HBT MMIC x4 ACTIVE
FREQUENCY MULTIPLIER, 9.8 - 11.2 GHz OUTPUT
NOTES:
1. MATERIAL PACKAGE BODY: LOW STRESS INJECTION MOLDED
PLASTIC SILICA AND SILICON IMPREGNATED.
2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY
3. LEAD AND GROUND PADDLE PLATING: Sn/Pb SOLDER
4. DIMENSIONS ARE IN INCHES [MILLIMETERS].
5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
6. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
7. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
8. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED
TO PCB RF GROUND.
9. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB
LAND PATTERN.



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