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TLP3073F bảng dữ liệu(PDF) 11 Page - Toshiba Semiconductor

tên linh kiện TLP3073F
Giải thích chi tiết về linh kiện  Photocouplers GaAs Infrared LED and Photo Triac
PDF  19 Pages
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nhà sản xuất  TOSHIBA [Toshiba Semiconductor]
Trang chủ  http://www.semicon.toshiba.co.jp/eng
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TLP3073F bảng dữ liệu(HTML) 11 Page - Toshiba Semiconductor

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TLP3073,TLP3073F
11
Table
Table
Table
Table 16.1
16.1
16.1
16.1 Insulation Related Specifications (Note)
Insulation Related Specifications (Note)
Insulation Related Specifications (Note)
Insulation Related Specifications (Note)
Insulation Related Parameters
Minimum creepage distance
Minimum clearance
Minimum insulation thickness
Comparative tracking index
Symbol
Cr
Cl
ti
CTI
TLP3073
7.0 mm
7.0 mm
0.4 mm
175
TLP3073F
8.0 mm
8.0 mm
0.4 mm
175
Note:
If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value. (e.
g., at a standard distance between soldering eye centers of 7.5 mm). If this is not permissible, the user shall
take suitable measures.
Note:
This photocoupler is suitable for safe electrical isolation
safe electrical isolation
safe electrical isolation
safe electrical isolation only within the safety limit data.
Maintenance of the safety data shall be ensured by means of protective circuits.
Fig.
Fig.
Fig.
Fig. 16.2
16.2
16.2
16.2 Marking on packing
Marking on packing
Marking on packing
Marking on packing
for EN60747
for EN60747
for EN60747
for EN60747
Fig.
Fig.
Fig.
Fig. 16.3
16.3
16.3
16.3 Marking Example of TLP3073 (Note)
Marking Example of TLP3073 (Note)
Marking Example of TLP3073 (Note)
Marking Example of TLP3073 (Note)
Fig.
Fig.
Fig.
Fig. 16.4
16.4
16.4
16.4 Marking Example of TLP3073F (Note)
Marking Example of TLP3073F (Note)
Marking Example of TLP3073F (Note)
Marking Example of TLP3073F (Note)
Note:
The above marking is applied to the photocouplers that have been qualified according to option (D4) of EN60747.
2016-02-03
Rev.4.0
©2016 Toshiba Corporation



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