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TLP104 bảng dữ liệu(PDF) 2 Page - Toshiba Semiconductor |
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TLP104 bảng dữ liệu(HTML) 2 Page - Toshiba Semiconductor |
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2 / 13 page ![]() TLP104 2015-10-16 2 Absolute Maximum Ratings (Ta = 25°C) Characteristic Symbol Rating Unit Forward Current IF 25 mA Forward Current Derating (Ta ≥ 110°C) ΔIF /°C -0.67 mA/°C Pulse Forward Current (Note 1) IFP 50 mA Pulse Forward Current Derating (Ta ≥ 110°C) ΔIFP /°C -1.34 mA/°C Input Power Dissipation PD 40 mW Reverse Voltage VR 5 V Output Current (Ta ≤ 125°C) IO 8 mA Output Voltage VO -0.5 to 30 V Supply Voltage VCC -0.5 to 30 V Output Power Dissipation PO 80 mW Output Power Dissipation Derating (Ta ≥ 110°C) ΔPO /°C -2.0 mW/°C Operating Temperature Range Topr -40 to 125 °C Storage Temperature Range Tstg -55 to 125 °C Lead Soldering Temperature (10 s) Tsol 260 °C Isolation Voltage (AC,60 s, R.H. ≤ 60%,Ta=25°C) (Note 2) BVs 3750 Vrms Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Pulse width ≤ 10μs, duty=10%. Note 2: This device is regarded as a two terminal device: pins 1 and 3 are shorted together, as are pins 4, 5 and 6. Recommended Operating Conditions Characteristic Symbol Min Typ. Max Unit Input Current , High Level IFHL 7.5 - 15 mA Input Voltage , Low Level VFLH 0 - 0.8 V Supply Voltage* VCC 4.5 - 30 V Operating Temperature Topr -40 - 125 °C * This item denotes operating range, not meaning of recommended operating conditions. Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the device. Additionally, each item is an independent guideline respectively. In developing designs using this product, please confirm specified characteristics shown in this document. |
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