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TPS732

www.ti.com

SBVS037P – AUGUST 2003 – REVISED DECEMBER 2015

Thermal Considerations (continued)

10.3.1 Power Dissipation

The ability to remove heat from the die is different for each package type, presenting different considerations in

the PCB layout. The PCB area around the device that is free of other components moves the heat from the

device to the ambient air. Performance data for JEDEC low- and high-K boards are shown in the Thermal

Information table. Using heavier copper increases the effectiveness in removing heat from the device. The

addition of plated through-holes to heat-dissipating layers also improves the heat-sink effectiveness.

(6)

Power dissipation can be minimized by using the lowest possible input voltage necessary to assure the required

output voltage.

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