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M02015

16

Low Power CMOS Transimpedance Amplifier with Rx Pwr Mon Output and AGC for Fiber

Optic Networks up to 2.5 Gbps

Rev V6

2.0 Pad Definitions

Table 2-1.

Pad Description

Die Pad No

Name

Function

1

AGC

Monitor or force AGC voltage

Power pin. Connect to most positive supply

3

PINK

4

PINA

Active PIN input. Connect to photo diode anode

6

MON

Analog current source output. Current matched to average photodiode current

7

DOUT

Differential data output (goes low as light increases)

8DOUTGND

9

GND

10

GND

11

DOUTGND

12

DOUT

Differential data output (goes high as light increases)

NA

Backside

Backside. Connect to the lowest potential, usually ground

NOTES:

1.

2.

All ground pads are common on the die. Only one ground pad needs to be connected to the TO-Can ground. However, connecting more than one ground

pad to the TO-Can ground, particularly those across the die from each other can improve performance in noisy environments.