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UT06MRA010 bảng dữ liệu(PDF) 8 Page - Aeroflex Circuit Technology

tên linh kiện UT06MRA010
Giải thích chi tiết về linh kiện  Commercial RadHardTM Gate Array Family
PDF  16 Pages
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nhà sản xuất  AEROFLEX [Aeroflex Circuit Technology]
Trang chủ  http://www.aeroflex.com
Logo AEROFLEX - Aeroflex Circuit Technology

UT06MRA010 bảng dữ liệu(HTML) 8 Page - Aeroflex Circuit Technology

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PHYSICAL DESIGN
Using three layers of metal interconnect, Aeroflex achieves
optimized layouts that maximize speed of critical nets, overall
chip performance, and design density up to 500,000 equivalent
gates.
Test Capability
Aeroflex supports all phases of test development from test stim-
ulus generation through high-speed production test. This
support includes ATPG, fault simulation, and fault grading. Scan
design options are available on all UT0.6
CRH storage ele-
ments. Automatic test program development capabilities handle
large vector sets for use with Aeroflex’s Teradyne Tiger tester
supporting high-speed testing (up to 1.2GHz with pin
multiplexing).
Unparalleled Quality and Reliability
Aeroflex is dedicated to meeting the stringent performance re-
quirements of aerospace and defense systems suppliers.
Aeroflex maintains the highest level of quality and reliability
through our Quality Management Program under MIL-PRF-
38535 and ISO-9001. In 1988, we were the first gate array man-
ufacturer to achieve QPL certification and qualification of our
technology families. Our product assurance program has kept
pace with the demands of certification and qualification.
Our quality management plan includes the following activities
and initiatives.
 Quality improvement plan
 Failure analysis program
 SPC plan
 Corrective action plan
 Change control program
 Standard Evaluation Circuit (SEC) and Technology Charac-
terization Vehicle (TCV) assessment program
 Certification and qualification program
Because of numerous product variations permitted with custom-
er specific designs, much of the reliability testing is performed
using a Standard Evaluation Circuit (SEC) and Technology
Characterization Vehicle (TCV). The TCV utilizes test struc-
tures to evaluate hot carrier aging, electromigration, and time
dependent test samples for reliability testing. Data from the wa-
fer-level testing can provide rapid feedback to the fabrication
process, as well as establish the reliability performance of the
product before it is packaged and shipped.
Radiation Tolerance
Aeroflex incorporates radiation-tolerance techniques in process
design, design rules, array design, power distribution, and li-
brary element design. All key radiation-tolerance process
parameters are controlled and monitored using statistical meth-
ods and in-line testing.
Notes:
1. Total dose Co-60 testing is in accordance with MIL-STD-883,
Method 1019. Data sheet electrical characteristics guaranteed to 1.0E5
rads(Si
O2). All post-radiation values measured at 25C.
2. Total dose Co-60 testing is in accordance with MIL-STD-883,
Method 1019 at dose rates <1 rad(Si
O2)/s.
3. Short pulse 20ns FWHM (full width, half maximum).
4. Is design dependent; SEU limit based on standard evaluation circuit at 4.5V
worst case condition.
5. SEU-hard flip-flop cell. Non-hard flip-flop typical is 4E-8.
PARAMETER
RADIATION
TOLERANCE
NOTES
Total dose
1.0E5 rad(SiO2)
3.0E5 rad(SiO2)
1
2
Dose rate upset
1.0E8 rad(Si)/sec
3
Dose rate
survivability
1.0E11 rad(Si)/sec
4
SEU
<2.0E-10 errors per cell-day
4, 5
Projected
neutron fluence
1.0E14 n/sq cm
Latchup
Latchup-immune over speci-
fied use conditions



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