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SC563 bảng dữ liệu(PDF) 14 Page - Semtech Corporation |
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SC563 bảng dữ liệu(HTML) 14 Page - Semtech Corporation |
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14 / 16 page ![]() SC563 4 Example A SC563LH is used to provide outputs of 3.3V, 50mA from LDO and .8V, 250mA from LDO2. The input voltage is 4.2V for LDO and 2.5V for LDO2, and the ambient temperature of the system is 60°C. P D= 0.5X(4.2 – 3.3) + 0.25X(2.5 – .8) = 0.3W and T J = 60 + (0.3 x 90) = 87.9°C This calculation shows the junction temperature is 87.9°C and it is below the maximum junction temperature of 25°C for this power dissipation. This example also dem- onstrates that with separate input voltages for LDO and LDO2, the total power dissipation can be reduced with the lower LDO output voltage fed by a lower input voltage. Applications Information (continued) Layout Considerations The diagram in Figure 3 below illustrates proper layout of a circuit. The layout considerations are listed below: Attach the thermal pad of the device to a copper pad with vias connected to the GND plane. This enables better heat transfer from the device to the PCB. Place the input and output capacitors close to the device for optimal transient response and device behavior. Extra copper trace length between the device input and output to the capacitor soldering pad introduces parasitic inductance. Connect all ground connections of the input and output capacitor directly to the ground plane whenever possible to minimize ground potential differences on the PCB. Shown in the evaluation board layout below, the SC563 thermal pad, ground pins, and the input and output capacitors are all connected to the ground plane through vias . • • • Figure 3 — SC563 Layout Example |
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