SN74LVC3G34DCUT datasheet(4/21 Pages) TI1

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SN74LVC3G34

SCES366L – AUGUST 2001 – REVISED OCTOBER 2015

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6.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

2500

Electrostatic

V(ESD)

Charged-device model (CDM), per JEDEC specification JESD22-C101, all

discharge

1500

pins(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

(1)

MIN

MAX

UNIT

Operating

1.65

5.5

VCC

Supply voltage

Data retention only

1.5

VCC = 1.65 V to 1.95 V

0.65 × VCC

VCC = 2.3 V to 2.7 V

1.7

VIH

High-level input voltage

VCC = 3 V to 3.6 V

VCC = 4.5 V to 5.5 V

0.7 × VCC

VCC = 1.65 V to 1.95 V

0.35 × VCC

VCC = 2.3 V to 2.7 V

0.7

VIL

Low-level input voltage

VCC = 3 V to 3.6 V

0.8

VCC = 4.5 V to 5.5 V

0.3 × VCC

Input voltage

5.5

Output voltage

VCC

VCC = 1.65 V

–4

VCC = 2.3 V

–8

IOH

High-level output current

–16

VCC = 3 V

–24

VCC = 4.5 V

–32

VCC = 1.65 V

VCC = 2.3 V

IOL

Low-level output current

VCC = 3 V

VCC = 4.5 V

VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V

Δt/Δv

Input transition rise or fall rate

VCC = 3.3 V ± 0.3 V

ns/V

VCC = 5 V ± 0.5 V

DCT, DCU Package

–40

125

Operating free-air temperature

°C

YZP Package

-40

(1)

All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, SCBA004.

6.4 Thermal Information

SN74LVC3G34

THERMAL METRIC(1)

DCT (SM8)

DCU (VSSOP)

YZP (DSBGA)

UNIT

8 PINS

RθJA

Junction-to-ambient thermal resistance

220

227

140

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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