5

LSF0101, LSF0102, LSF0108

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SDLS966G – DECEMBER 2013 – REVISED FEBRUAURY 2016

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(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The input and input/output negative-voltage ratings may be exceeded if the input and input/output clamp-current ratings are observed.

(3)

The package thermal impedance is calculated in accordance with JESD 51-7.

6 Specifications

6.1 Absolute Maximum Ratings

(1)

over operating free-air temperature (unless otherwise noted)

MIN

MAX

UNIT

–0.5

7

V

–0.5

7

V

Continuous channel current

128

mA

Input clamp current

–50

mA

DCT package

220

°C/W

DCU package

227

Storage temperature range

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Input/output voltage

0

5

V

Reference voltage

0

5

V

Pass transistor current

64

mA

Operating free-air temperature

–40

125

°C