STPTIC-33G2C5 datasheet(5/10 Pages) STMICROELECTRONICS

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STPTIC-27L2

Package information

•

Epoxy meets UL94, V0

•

Lead-free package

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

2.1

Flip-Chip package information

Figure 7. Flip-Chip package outline

The land pattern below is recommended for soldering the STPTIC-G2 on PCB.

NC stands for No Connect, this pad must not be connected on application board. Please

leave this pad floating.

Table 4. Flip-Chip package dimensions

Dimensions (in microns)

STPTIC-27L2

1000

750

140

500

360

105

540

225

315

125

165

Tolerance

±30

±15

±10

±15

±10

±20

±40

±20

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