2 Pad Ceramic Base SMD Crystal, 1.6 mm x 1.0 mm

IL3W Series

ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ●

www.ilsiamerica.com

Specifications subject to change without notice

Rev: 03/25/15_A

Page 2 of 2

Pb Free Solder Reflow Profile:

Typical Circuit:

*Units are backward compatible with 240C reflow processes

Package Information:

MSL = 2a

Termination = e4 (Au over Ni over W base metal)

Tape and Reel Information:

Environmental Specifications

Thermal Shock

MIL-STD-883, Method 1011, Condition A

Moisture Resistance

MIL-STD-883, Method 1004

Mechanical Shock

MIL-STD-883, Method 2002, Condition B

Mechanical Vibration

MIL-STD-883, Method 2007, Condition A

Resistance to Soldering Heat

J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)

Hazardous Substance

Pb-Free / RoHS / Green Compliant

Solderability

JESD22-B102-D Method 2 (Preconditioning E)

Terminal Strength

MIL-STD-883, Method 2004, Test Condition D

Gross Leak

MIL-STD-883, Method 1014, Condition C

Fine Leak

MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s

Solvent Resistance

MIL-STD-202, Method 215

Marking

Line 1: Frequency, Date Code

PROPRIETARY AND CONFIDENTIAL

THIS DOCUMENT CONTAINS PROPRIETARY INFORMATION, AND SUCH INFORMATION MAY NOT BE DISCLOSED TO OTHERS FOR ANY

PURPOSE NOR USED FOR MANUFACTURING PURPOSES WITHOUT WRITTEN PERMISSION FROM ILSI America.

Quantity per

Reel

3000

A

8.0 ±0.2

B

4.0 ±0.1

C

3.5 ±0.05

D

9.0 ±0.3

E

60 / 80

F

180 / 250