8

TUSB4041I-Q1

SLLSEK4B – JULY 2015 – REVISED JANUARY 2016

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Copyright © 2015–2016, Texas Instruments Incorporated

Pin Functions (continued)

PIN

DESCRIPTION

NAME

NO.

TEST

17

I

PD

This pin is reserved for factory test.

POWER AND GROUND SIGNALS

NC

28

—

—

No connection, leave floating

40

19

—

PWR

1.1-V power rail

25

37

45

53

60

63

2

—

PWR

3.3-V power rail

20

31

48

Thermal Pad

—

—

Ground. The thermal pad must be connected to ground.

(1)

Stresses beyond those listed as Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated as Recommended Operating Conditions

is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

–0.3

1.4

V

–0.3

3.8

V

Voltage

USB_VBUS pin

–0.3

1.4

V

XI pins

–0.3

2.45

V

All other pins

–0.3

3.8

V

–65

150

°C

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

Charged-device model (CDM), per AEC Q100-011

±750