ISO7240CFDWR datasheet(25/46 Pages) TI1

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100

150

200

250

300

100

150

200

T - Case Temperature - °C

at 3.6 V

CC1,2

at 5.5 V

CC1,2

100

250

500

750

1000

WORKING VOLTAGE (V

IORM) -- VPK

VIORM at 560-VPK

28 Years

880

120

ISO7240CF, ISO7240C, ISO7240M

ISO7241C, ISO7241M, ISO7242C, ISO7242M

www.ti.com

SLLS868R – SEPTEMBER 2007 – REVISED SEPTEMBER 2015

9.3.3 Life Expectancy vs. Working Voltage

Figure 16. Time-Dependant Dielectric Breakdown Testing Results

9.3.4 Safety Limiting Values

Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry.

A failure of the IO can allow low resistance to ground or the supply and, without current limiting, dissipate

sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system

failures.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

θJA = 168°C/W, VI = 5.5 V, TJ = 170°C, TA = 25°C

156

Safety input, output, or

SOIC-

supply current

θJA = 168°C/W, VI = 3.6 V, TJ = 170°C, TA = 25°C

239

SOIC-

150

°C

Maximum case temperature

The safety-limiting constraint is the absolute maximum junction temperature specified in the absolute maximum

ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the

application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the

Thermal Characteristics table is that of a device installed in the JESD51-3, Low Effective Thermal Conductivity

Test Board for Leaded Surface Mount Packages and is conservative. The power is the recommended maximum

input voltage times the current. The junction temperature is then the ambient temperature plus the power times

the junction-to-air thermal resistance.

Figure 17. SOIC-16

ΘJC Thermal Derating Curve per VDE

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