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LPS25HB bảng dữ liệu(PDF) 17 Page - STMicroelectronics

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LPS25HB bảng dữ liệu(HTML) 17 Page - STMicroelectronics

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LPS25HB
Application hints
40
5
Application hints
Figure 5. LPS25HB electrical connections (top view)
The device power supply must be provided through the VDD line; the power supply
decoupling capacitor C1 (100 nF) must be placed as near as possible to the supply pads of
the device. Depending on the application, an additional capacitor of 4.7 µF could be placed
on VDD line.
The functionality of the device and the measured data outputs are selectable and accessible
through the I²C/SPI interface. When using the I²C, CS must be tied to Vdd_IO.
All the voltage and ground supplies must be present at the same time to have proper
behavior of the IC (refer to Figure 5.). It is possible to remove VDD while maintaining
Vdd_IO without blocking the communication bus, in this condition the measurement chain is
powered off.
5.1
Soldering information
The HLGA package is compliant with the ECOPACK® standard and it is qualified for
soldering heat resistance according to JEDEC J-STD-020.
10
GND
8
9
35
4
7
6
1
2
Vdd_IO
SCL/SPC
VDD
INT_DRDY
CS
GND
C1
GND
Pin indicator



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