STM32F756VG datasheet(202/228 Pages) STMICROELECTRONICS

tên linh kiện	STM32F756VG

Giải thích chi tiết về linh kiện	Up to 25 communication interfaces

PDF	228 Pages

Scroll/Zoom	100%

nhà sản xuất	STMICROELECTRONICS [STMicroelectronics]

Trang chủ	http://www.st.com

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202 / 228 page

Package information

STM32F756xx

202/228

DocID027589 Rev 4

Marking of engineering samples

The following figure gives an example of topside marking orientation versus ball A1 identifier

location.

Figure 84. TFBGA100, 8 × 8 × 0.8mm thin fine-pitch ball grid array package

top view example

1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet

qualified and therefore not yet ready to be used in production and any consequences deriving from such

usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering

samples in production. ST Quality has to be contacted prior to any decision to use these Engineering

samples to run qualification activity.

Table 114. TFBGA100 recommended PCB design rules (0.8 mm pitch BGA)

Dimension

Recommended values

Pitch

0.8

Dpad

0.400 mm

Dsm

0.470 mm typ (depends on the soldermask

registration tolerance)

Stencil opening

0.400 mm

Stencil thickness

Between 0.100 mm and 0.125 mm

Pad trace width

0.120 mm

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