STPTIC-33G2 datasheet(5/11 Pages) STMICROELECTRONICS

tên linh kiện	STPTIC-33G2

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DocID028149 Rev 1

5/11

STPTIC-33G2

Package information

•

Epoxy meets UL94, V0

•

Lead-free package

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

2.1

Flip-Chip package information

Figure 7. Flip-Chip package outline

The land pattern below is recommended for soldering the STPTIC-G2 on PCB.

NC stands for No Connect, this pad must not be connected on application board. Please

leave this pad floating.

Table 4. Flip-Chip package dimensions

Dimensions (micron)

STPTIC-15/27/33/39/47G2

640

590

120

400

120

420

200

290

125

165

STPTIC-56G2

710

190

STPTIC-68G2

780

260

STPTIC-82G2

880

360

Tolerance

±30

±15

±10

±15

±10

±20

±40

±20

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