Revision 1.8

5 - 20

AS3833

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

Electrical Parameters

VDDH to VSS, VDDH_HC to VSS

-0.3

55

V

VDDM to VSS, GATE to VSS

-0.3

25

V

xFAULT to VSS

-0.3

7

V

VDDL to VSS

-0.3

5

V

Analog Pin Voltage to VSS

1

1. Pins Vth, UVLO, Comp, Sense, FB, Iset, Ex, Bx

-0.3

5

V

Digital Pin Voltage to VSS

2

2. Pins PWMx

-0.3

5

V

Input Current (latch-up immunity)

-100

100

mA

Norm: JEDEC 78

Electrostatic Discharge

Electrostatic Discharge HBM

+/- 1500

V

Norm: MIL 883 E method 3015

Electrostatic Discharge MM

+/- 200

V

Norm: JESD22-A115C

Continuos Power Dissipation

1.5

W

3

for SOIC-28 Package

3. Depending on actual PCB layout and PCB used.

Continuos Power Dissipation Derating Factor

13

mW / °C

4

Temperature Ranges and Storage Conditions

Junction to ambient thermal resistance

76

ºC/W

SOIC-28 Package.

For more information about thermal metrics, see

application note AN01 Thermal Characteristics.

+150

ºC

Storage Temperature Range

-55

+150

ºC

Package Body Temperature

+260

ºC

The reflow peak soldering temperature (body

temperature) specified is in accordance with IPC/

JEDEC J-STD-020“Moisture/Reflow Sensitivity

Classification for Non-Hermetic Solid State Surface

Mount Devices”.

The lead finish for Pb-free leaded packages is matte

tin (100% Sn).

Humidity non-condensing

5

85

%

Moisture Sensitive Level

1

Represents a max. floor life time of unlimited