TL331IDBVR datasheet(4/18 Pages) TI1

4 / 18 page

TL331

SLVS238G – AUGUST 1999 – REVISED JANUARY 2015

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VCC

Supply voltage(2)

VID

Differential input voltage(3)

–36

Input voltage range (either input)

–0.3

Output voltage

Output current

Duration of output short-circuit to ground(4)

Unlimited

Operating virtual junction temperature

–40

150

°C

Tstg

Storage temperature range

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values, except differential voltages, are with respect to the network ground.

(3)

Differential voltages are at IN+ with respect to IN–.

(4)

Short circuits from outputs to VCC can cause excessive heating and eventual destruction.

7.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±1000

V(ESD)

Electrostatic discharge

Charged device model (CDM), per JEDEC specification JESD22-C101,

±750

all pins(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VCC

Supply voltage

Junction Temperature

-40

125

°C

7.4 Thermal Information

TL331

THERMAL METRIC(1)

DBV

UNIT

5 PINS

RθJA

Junction-to-ambient thermal resistance

218.3

RθJC(top)

Junction-to-case (top) thermal resistance

87.3

RθJB

Junction-to-board thermal resistance

44.9

°C/W

ψJT

Junction-to-top characterization parameter

4.3

ψJB

Junction-to-board characterization parameter

44.1

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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