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ZXMS6004DN8 bảng dữ liệu(PDF) 3 Page - Diodes Incorporated

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ZXMS6004DN8 bảng dữ liệu(HTML) 3 Page - Diodes Incorporated

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ZXMS6004DN8
Document number: DS38040 Rev. 2 - 2
3 of 9
www.diodes.com
August 2015
© Diodes Incorporated
ZXMS6004DN8
Thermal Characteristics
Characteristic
Symbol
Value
Units
Power Dissipation at Tamb = +25°C (Note 5)
Linear Derating Factor
PD
1.21
9.7
W
mW/°C
Power Dissipation at Tamb = +25°C (Note 6)
Linear Derating Factor
PD
1.56
12.5
W
mW/°C
Thermal Resistance, Junction to Ambient (Note 5)
RθJA
103
°C/W
Thermal Resistance, Junction to Ambient (Note 6)
RθJA
81
°C/W
Thermal Resistance, Junction to Case (Note 7)
RθJC
13.5
°C/W
Operating Temperature Range
TJ
-40 to +150
°C
Storage Temperature Range
TSTG
-55 to +150
°C
Notes:
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper plate.
7. Thermal resistance between junction and the mounting surfaces of drain and source pins.
Recommended Operating Conditions
The ZXMS6004DN8 is optimized for use with µC operating from 3.3V and 5V supplies.
Characteristic
Symbol
Min
Max
Unit
Input Voltage Range
VIN
0
5.5
V
Ambient Temperature Range
TA
-40
+125
°C
High Level Input Voltage for MOSFET to be On
VIH
3
5.5
V
Low Level Input Voltage for MOSFET to be Off
VIL
0
0.7
V
Peripheral Supply Voltage (voltage to which load is referred)
VP
0
36
V



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