TL971, TL972, TL974

SLOS467H – OCTOBER 2006 – REVISED JANUARY 2015

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage range

2.7

15

V

±1 V

V

V

Maximum junction temperature

150

°C

Storage temperature range

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Differential voltages for the noninverting input terminal are with respect to the inverting input terminal.

(3)

7.2 ESD Ratings

VALUE

UNIT

2000

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-C101,

1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

MIN

MAX

UNIT

Supply voltage

2.7

12

V

Common-mode input voltage

V

Operating free-air temperature

–40

125

°C

7.4 Thermal Information

TL971

TL972

TL974

UNIT

8 PINS

5 PINS

8 PINS

14 PINS

Package

thermal

impedance,

97

206

97

172

44

85

149

86

80

113

°C/W

junction to

free air

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).

(2)

Package thermal impedance is calculated in accordance with JESD 51-7.

(3)

Package thermal impedance is calculated in accordance with JESD 51-5.

4

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