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MTP5P06V bảng dữ liệu(PDF) 2 Page - ON Semiconductor |
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MTP5P06V bảng dữ liệu(HTML) 2 Page - ON Semiconductor |
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2 / 7 page ![]() MTP5P06V http://onsemi.com 2 ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS Drain−Source Breakdown Voltage (VGS = 0 Vdc, ID = 0.25 mAdc) Temperature Coefficient (Positive) V(BR)DSS 60 − − 61.2 − − Vdc mV/°C Zero Gate Voltage Drain Current (VDS = 60 Vdc, VGS = 0 Vdc) (VDS = 60 Vdc, VGS = 0 Vdc, TJ = 150°C) IDSS − − − − 10 100 μAdc Gate−Body Leakage Current (VGS = ± 15 Vdc, VDS = 0 Vdc) IGSS − − 100 nAdc ON CHARACTERISTICS (Note 1) Gate Threshold Voltage (VDS = VGS, ID = 250 μAdc) Threshold Temperature Coefficient (Negative) VGS(th) 2.0 − 2.8 4.7 4.0 − Vdc mV/°C Static Drain−Source On−Resistance (VGS = 10 Vdc, ID = 2.5 Adc) RDS(on) − 0.34 0.45 Ohm Drain−Source On−Voltage (VGS = 10 Vdc, ID = 5 Adc) (VGS = 10 Vdc, ID = 2.5 Adc, TJ = 150°C) VDS(on) − − − − 2.7 2.6 Vdc Forward Transconductance (VDS = 15 Vdc, ID = 2.5 Adc) gFS 1.5 3.6 − Mhos DYNAMIC CHARACTERISTICS Input Capacitance (VDS = 25 Vdc, VGS = 0 Vdc, f = 1.0 MHz) Ciss − 367 510 pF Output Capacitance Coss − 140 200 Transfer Capacitance Crss − 29 60 SWITCHING CHARACTERISTICS (Note 2) Turn−On Delay Time (VDD = 30 Vdc, ID = 5 Adc, VGS = 10 Vdc, RG = 9.1 Ω) td(on) − 11 20 ns Rise Time tr − 26 50 Turn−Off Delay Time td(off) − 17 30 Fall Time tf − 19 40 Gate Charge (See Figure 8) (VDS = 48 Vdc, ID = 5 Adc, VGS = 10 Vdc) QT − 12 20 nC Q1 − 3.0 − Q2 − 5.0 − Q3 − 5.0 − SOURCE−DRAIN DIODE CHARACTERISTICS Forward On−Voltage (IS = 5 Adc, VGS = 0 Vdc) (IS = 5 Adc, VGS = 0 Vdc, TJ = 150°C) VSD − − 1.72 1.34 3.5 − Vdc Reverse Recovery Time (IS = 5 Adc, VGS = 0 Vdc, dIS/dt = 100 A/μs) trr − 97 − ns ta − 73 − tb − 24 − Reverse Recovery Stored Charge QRR − 0.42 − μC INTERNAL PACKAGE INDUCTANCE Internal Drain Inductance (Measured from contact screw on tab to center of die) (Measured from the drain lead 0.25″ from package to center of die) LD − 3.5 4.5 − nH Internal Source Inductance (Measured from the source lead 0.25″ from package to source bond pad) LS − 7.5 − nH 1. Pulse Test: Pulse Width ≤ 300 μs, Duty Cycle ≤ 2%. 2. Switching characteristics are independent of operating junction temperature. |
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