RV datasheet(2/5 Pages) VISHAY

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Vishay Sfernice

Revision: 21-Jun-14

Document Number: 60022

For technical questions, contact: sferthinfilm@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

POPULAR OPTION

AEC-Q200 moisture resistance



Option to order: 0058: Specific production process to withstand 85 °C/85 % RH at Pn/10

Notes

(1) Test requiring parts to be mounted on PCB will be performed with the requirement that termination alloy will be the same as solder paste

alloy. Gold termination will be tested as B termination

(2) Rn: Nominal Resistance



Pn: Nominal Power

(3) Option to order: 0058

DIMENSIONS in millimeters (inches)

SERIES/



CASE SIZES

D/E

Min.

Max.

Min.

Max.

Min.

Max.

Min.

Max.

RV 0505

1.198

(0.047)

1.502

(0.059)

1.143

(0.045)

1.397

(0.055)

0.250

(0.010)

0.510

(0.020)

0.373

(0.015)

0.627

(0.025)

RV 0603

1.368

(0.054)

1.672

(0.066)

0.623

(0.025)

0.877

(0.035)

0.250

(0.010)

0.510

(0.020)

0.373

(0.015)

0.627

(0.025)

RV 0805

1.758

(0.069)

2.062

(0.081)

1.143

(0.045)

1.397

(0.055)

0.250

(0.010)

0.510

(0.020)

0.373

(0.015)

0.627

(0.025)

RV 1206

2.908

(0.114)

3.212

(0.126)

1.473

(0.058)

1.727

(0.068)

0.250

(0.010)

0.510

(0.020)

0.373

(0.015)

0.627

(0.025)

ENVIRONMENTAL TEST

TEST

CONDITIONS

VALUES AND DRIFTS (

R/R ± %)

CECC REQUIREMENTS

TYPICAL PERFORMANCE

Overload

6.25 x rated power / 2 s (or 2 UL)

0.05 % Rn (2) + 0.05



0.01 % Rn (2)

Climatic sequences (1)

-55 °C / +155 °C

5 moisture cycles

0.1 % Rn (2) + 0.05



0.02 % Rn (2)

Thermal shock (1)

-55 °C / +155 °C

5 cycles 30 min

0.05 % Rn (2) + 0.05



0.02 % Rn (2)

Load life (1)

+70 °C/Pn

1000 h

0.1 % Rn (2) + 0.05



0.05 % Rn (2)

Resistance to solder heat

+260 °C/ 10 s

0.05 % Rn (2) + 0.05



0.02 % Rn (2)

Moisture resistance (1)

+40 °C / 93 % HR

Pn / 10

0.1 % Rn (2) + 0.05



0.01 % Rn (2)

AEC-Q200 (3)

85 °C / 85 % RH / Pn / 10

1000 h

0.5 % + 0.05



Max. < 0.3 % + 0.05



High temperature storage

1000 h at + 155 °C

0.1 % Rn (2) + 0.05



0.05 % Rn (2)

Bending (1)

10 bends / 2 mm / 5 s

0.05 % Rn (2) + 0.05



0.02 % Rn (2)

SPECIFIC CONDITIONS DUE TO TERMINATION TYPE

TEST

CONDITIONS

VALUES AND DRIFTS

B; G

VISHAY REQUIREMENTS

TYPICAL PERFORMANCE

Solderability

+235 °C/2 s

Sn60Pb40 alloy

+245 °C/3 s

Sn97Ag3 alloy

VISUAL INSPECTION

High T° reflow profile

N/A

+255 °C/40 s

(on parts)

0.02 % Rn (2) + 0.05



0.01 % Rn (2) + 0.05



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