CHP, HCHP

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Vishay Sfernice

Revision: 19-May-14

4

Document Number: 52023

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

TYPICAL HF PERFORMANCE OF HCHP

POPULAR OPTIONS

For any option it is recommended to consult Vishay Sfernice for availability first.

Option: Enlarged terminations: 0063



For stringent and special power dissipation requirements, the thermal resistance between the resistive layer and the solder joint

can be reduced using enlarged terminations chip resistors which are soldered on large and thick copper pads acting as heat

sinks (see application note: 53048 Power Dissipation in High Precision Vishay Sfernice Chip Resistors and Arrays (P Thin Film,

Option to order: 0063 (applies to size 1206/1505/1020/2010/2512).

2.0

1.6

1.8

1.2

1.4

1.0

0.8

0.6

0.4

0.2

0

1

10

100

1000

10 000

f (MHz)

Size 0603 (W/A)

100 k

Ω

1 M

Ω

1 k

Ω

10 k

Ω

100

Ω

200

Ω

1

Ω

10

Ω

2.0

1.6

1.8

1.2

1.4

1.0

0.8

0.6

0.4

0.2

0

1

10

100

1000

10 000

f (MHz)

Size 0603 (Flip chip)

100 k

Ω

1 M

Ω

1 k

Ω

10 k

Ω

100

Ω

200

Ω

1

Ω

10

Ω

DIMENSIONS (Option 0063) in millimeters

CASE



SIZE

AB

C

D

E

± 0.152

± 0.127

± 0.127

± 0.127

± 0.127

1206

3.00

1.73

0.38

0.40

1.19

1505

3.70

1.25

0.50

0.50

1.54

2010

5.03

2.64

0.50

0.50

2.20

1020

2.49

5.18

0.50

0.31

0.93

2208

5.53

2.05

0.50

0.50

2.45

2512

6.30

3.30

0.50

0.50

2.84

B

E

D

Enlarged

termination

Uncoated

ceramic

Bottom view for mounting

A

C