SG3546DM datasheet(2/7 Pages) MICROSEMI

2 / 7 page

3.3V U NDER VOL T A G E S ENSING C IRCUIT

SG3546

PRODUCT DA T ABOOK 1996/1997

Rev. 1.3

2/96

P RODUCTION D ATA S HEET

ABSOLUTE MAXIMUM RATINGS

(Note 1)

Input Supply Voltage (V

IN) ............................................................................... -1V to 12V

RESET Output Voltage (V

OUT) .......................................................................... -1V to 12V

Clamp Diode Forward Current .............................................................................. 100mA

Operating Junction Temperature

Plastic (DM - Package) ......................................................................................... 150°C

Storage Temperature Range ...................................................................... -65°C to 150°C

Lead Temperature (Soldering, 10 seconds) ............................................................ 300°C

PACKAGE PIN OUTS

RESET

INPUT

N.C.

GROUND

N.C.

DM PACKAGE

(Top View)

Note 1. Values beyond which damage may occur. All voltages are specified with respect to

ground, and all currents are positive into the specified terminal.

DM PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

165°C/W

LP PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

156°C/W

Junction Temperature Calculation: T

= T

+ (P

The

JA numbers are guidelines for the thermal performance of the device/pc-board system.

All of the above assume no ambient airflow.

THERMAL DATA

BLOCK DIAGRAM

LP PACKAGE

(Top View)

3. GROUND

2. INPUT

1. RESET

1.2 V

REF

INPUT

RESET

GROUND

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