SM5021 series

NIPPON PRECISION CIRCUITS—3

PAD LAYOUT

(Unit :

µm)

PINOUT

(Top View)

PIN DESCRIPTION and PAD DIMENSIONS

BLOCK DIAGRAM

Chip size: 1.00

× 0.80 mm

Chip thickness: 220 ± 30 µm

Q

VDD

XT

VSS

(0,0)

(1000,800)

INH

XT

HA5021

1

XT

VSS

Q

VDD

2

3

6

5

4

XT

INH

Number

Name

I/O

Description

Pad dimensions [µm]

XY

1

INH

I

Output state control input. High impedance when LOW. Pull-up resistor built in

771

150

2

XT

I

Amplifier input.

Crystal oscillator connection pins.

Crystal oscillator connected between XT and XT

553

150

3

VSS

–

Ground

150

140

4

Q

O

150

649

5

VDD

–

Supply voltage

796

409

6XT

O

Amplifier output.

Crystal oscillator connection pins.

Crystal oscillator connected between XT and XT

836

636

XT

VSS

VDD

Q

XT

INH