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LX1563IDM bảng dữ liệu(PDF) 2 Page - Microsemi Corporation |
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LX1563IDM bảng dữ liệu(HTML) 2 Page - Microsemi Corporation |
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2 / 25 page ![]() SECOND-GENERATION POWER FACTOR C ONTROLLER LX1562/1563 PRODUCT DA T ABOOK 1996/1997 Copyright © 1996 Rev. 1.3 12/96 2 P RODUCTION D ATA S HEET ABSOLUTE MAXIMUM RATINGS (Note 1) Supply Voltage (V IN) ...................................................................................... -0.3V to 28V Peak Driver Output Current (Note 3) ................................................................. ±500mA Driver Output Clamping Diodes V O > VCC or VO < -0.3V ........................................................................................ ±10mA Detector Clamping Diodes V DET > 6V or VDET < 0.9V ..................................................................................... ±10mA Error Amp, Multiplier, and Comparator Input Voltages ................................ -0.3V to 6V Detector Input Voltage (Note 2) ....................................................................... -0.3 to 6V Operating Junction Temperature Plastic (M and DM Packages) ............................................................................... 150°C Storage Temperature Range ...................................................................... -65°C to 150°C Lead Temperature (Soldering, 10 Seconds) ............................................................ 300°C PACKAGE PIN OUTS V IN OUT GROUND I DET E.A. INV. E.A. OUT MULT. INPUT C.S. 1 8 27 36 45 M PACKAGE (Top View) DM PACKAGE (Top View) V IN OUT GROUND I DET E.A. INV. E.A. OUT MULT. INPUT C.S. 1 8 27 36 45 Note 1. Values beyond which damage may occur. All voltages are specified with respect to ground, and all currents are positive into the specified terminal. Note 2. With no limiting resistor. Note 3. Current duty cycle is chosen such that T J is below 150°C. THERMAL DATA M PACKAGE: THERMAL RESISTANCE-JUNCTION TO AMBIENT, θθθθθ JA 95°C/W DM PACKAGE: THERMAL RESISTANCE-JUNCTION TO AMBIENT, θθθθθ JA 165°C/W Junction Temperature Calculation: T J = TA + (PD x θJA). The θ JA numbers are guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow |
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