LSP1002 datasheet(1/3 Pages) MICROSEMI

tên linh kiện	LSP1002

Giải thích chi tiết về linh kiện	ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES

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Microsemi

Microwave Products Division

75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748

Page 1

Copyright

 2000

MSC1618.PDF 2000-11-06

LSP1000 thru LSP1012

ENHANCED PERFORMANCE

SURFACE MOUNT "EPSM" PACKAGED DEVICES

PRODUCT PREVIEW

M I CR O W A V E P RO D UCT S D IV I S IO N

DESCRIPTION

Our EPSM packaged devices are designed for the most demanding

commercial and Military requirements where the inconsistency of

performance inherent in plastic surface mount packages cannot be

tolerated.

These package styles extend the surface mount construction

format to 6 GHz for high performance wireless applications including

VCO's, limiters, pin switches and pin attenuators. Select PIN diodes for

switching, attenuation or limiting through 6 GHz. They are available in

multiple chip configuration as well as outlines which directly replace SOT-

23 and SOD-323 devices. Other devices and values are always available -

contact our applications engineering department for more details.

IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com

PIN DIODE DEVICES FOR WIRELESS ATTENUATORS,

SWITCHES AND LIMITERS

ABSOLUTE MAXIMUM RATINGS AT 25

°°°°C

Forward Current (IF):

1 Amp (1

µµµµs Pulse)

Power Dissipation (PD):

500 mW

(Derate to 0 at max TJ)

Peak Inverse Volts (PIV):

Same as VB

Junction Temp. (Operating):

-65

°°°°C to + 125°°°°C

Storage Temp. (Non-Operating):

-65

°°°°C to + 125°°°°C

Leakage:

<50 nA @ 80

%

VB@ 25

°°°°C

TEST CONDITIONS:

VB @ 10

µµµµA

RS @ 100 MHz

CT @ 1 MHz

TL @ IF = 10 mA

IR = 6 mA

KEY FEATURE S

!"Frequencies from VHF to 6

GHz

!"Lower Parasitics

!"Mil Grade Ceramic/Epoxy

Amalgam Construction

!"Dense SiO2 Junction

Passivation

!"Superior

Consistency/Repeatability

!"Footprints Available for

SOT-23/SOD-323/SOD-123

!"Priced for Commercial

Products

!"Tape & Reel for Volume

Pick & Place

APPLICATIONS/BENEFIT

APPLICATIONS/BENEFITS

SS

S

!"High performance wireless

surface mounting including:

!"GSM

!"TAGS

!"WANS

!"PCS

!"AMPS

!"DECT

!"CELLULAR

TABLE 1

MODEL

VB

CT @ VR

MAX.

RS @ IF

MAX.

TL

TYP.

APPLIC

-TION

LSP1000

> 35

.28 @ 5V

2.5

Ω

Ω @

5 mA

80nS

SWITCH

LSP1002

> 100

.32 @

50V

4

Ω

Ω @

100 mA

1500nS

ATTENU-

ATOR

LSP1004

> 35

.75 @

20V

0.6

Ω

Ω @

10 mA

150nS

SWITCH

LSP1011

> 200V

.35 @

50V

2

Ω

Ω @

100 mA

2000nS

ATTENU-

ATOR

LSP1012

> 20V

.35pF @

10V

1.8

Ω

Ω @

10 mA

5nS

LIMITER

Số phần tương tự - LSP1002

nhà sản xuất	tên linh kiện	bảng dữ liệu	Giải thích chi tiết về linh kiện
Microsemi Corporation	LSP1002	109Kb / 3P	ENHANCED PERFORMANCE SURFACE MOUNT EPSM PIN Diodes TM

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Mô tả tương tự - LSP1002

nhà sản xuất	tên linh kiện	bảng dữ liệu	Giải thích chi tiết về linh kiện
Microsemi Corporation	KV1913A	290Kb / 4P	ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES
	KV1913A	158Kb / 3P	ENHANCED PERFORMANCE SURFACE MOUNT EPSM?줙yperabrupt Varactor Diodes TM
	LSP1000	109Kb / 3P	ENHANCED PERFORMANCE SURFACE MOUNT EPSM PIN Diodes TM
StarHope	USM	280Kb / 2P	Surface Mount Devices
	TSM	826Kb / 2P	Surface Mount Devices
	SM	1Mb / 3P	Surface Mount Devices
	MSM	505Kb / 3P	Surface Mount Devices
	ISM	288Kb / 2P	Surface Mount Devices
	DSM	290Kb / 2P	Surface Mount Devices
Shanghai Leiditech Elec...	SMD1210P150L	391Kb / 8P	Surface-mount Devices

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Số phần tương tự - LSP1002

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