MSC1596.PDF

ISO 9001 CERTIFIED

REV B 3/13/2000

CHFP6KE5.0 thru CHFP6KE170CA

ATTACHMENT AND CONFORMAL COATING

INSTRUCTIONS

FOR Flip-Chip COMPONENTS

The .010” thick tab standoffs minimize shorting during attachment; however, minimal

solder/conductive epoxy must be used and carefully controlled to prevent excess

attachment material from wicking up the side of the tab and shorting across the junction.

Maximum recommended solder temperatures are 212 C for IR reflow and 221 C for

vapor-phase reflow. For flip-chip protection, coating material is Stycast ™ 2651-40 low-

viscosity epoxy manufactured by Emerson & Cuming. Follow instructions carefully for

preparation of the epoxy to prevent entrapment of air bubbles. Make sure that Flip-Chips

have been baked at 100 C for 15 minutes minimum to out-gas any adsorbed moisture

immediately prior to coating. Epoxy-coating material should be dispensed around the

edges of the chip with an appropriately sized syringe after which epoxy is de-aired to

remove bubbles entrapped beneath the chip. Cure epoxy as instructed by the supplier.

PEAK PULSE POWER Vs PULSE TIME

PEAK PULSE

POWER DERATING

TP – PULSE TIME – SEC

TEMPERATURE °C