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EXAMPLE BOARD LAYOUT

0.05 MAX

ALL AROUND

0.05 MIN

ALL AROUND

28X (1.3)

(6.1)

28X (0.45)

(0.9) TYP

28X (1.5)

28X (0.45)

26X

(0.65)

(3)

(3.4)

NOTE 9

(5.5)

SOLDER

MASK

OPENING

(9.7)

(1.3)

(1.3) TYP

(5.8)

(

) TYP

VIA

0.2

(0.65) TYP

4214870/A 10/2014

PowerPAD - 1.1 mm max height

PWP0028A

PLASTIC SMALL OUTLINE

SOLDER MASK

DEFINED PAD

LAND PATTERN EXAMPLE

SCALE:6X

HV / ISOLATION OPTION

0.9 CLEARANCE CREEPAGE

OTHER DIMENSIONS IDENTICAL TO IPC-7351

TM

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

8. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

numbers SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).

9. Size of metal pad may vary due to creepage requirement.

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

SOLDER MASK DETAILS

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

SOLDER MASK

DEFINED

SYMM

SYMM

SEE DETAILS

1

14

15

28

METAL COVERED

BY SOLDER MASK

SOLDER

MASK

OPENING

IPC-7351 NOMINAL

0.65 CLEARANCE CREEPAGE