TPS62650_15 datasheet(2/39 Pages) TI

2 / 39 page

TPS62650

TPS62651

SLVS808B

– AUGUST 2009 – REVISED JULY 2011

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

DEFAULT

PACKAGE

I2C ADDRESS BITS(2)

PART

OUTPUT VOLTAGE

OUTPUT VOLTAGE(2)

PACKAGE(3)

ORDERING

MARKING

NUMBER(1)

RANGE(2)

(CC)

VSEL0

VSEL1

TPS62650(4)

0.75 V to 1.4375 V

1.05 V

1.2 V

YFF-9

TPS62650YFF

TPS62651(4)

0.75 V to 1.4375 V

0.95 V

1.1 V

YFF-9

TPS62651YFF

(1)

All devices are specified for operation in the commercial temperature range,

–40°C to 85°C.

(2)

For customized output voltage limits (within a 0.75 V to 1.5375 V range), default output voltage and I2C address, contact the factory.

Internal tap points are available to facilitate default output voltage settings in multiples of 50 mV.

(3)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(4)

The following registers bits are set by internal hardware logic and not user programmable through I2C:

(a) VSEL0[7] = 1

(b) VSEL1[7] = 1

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

(1)

VALUE

UNIT

MIN

MAX

at VIN, SW(2)

–0.3

Input Voltage

at FB (2)

–0.3

3.6

at EN, VSEL, SCL, SDA (2)

–0.3

VI + 0.3

Power dissipation

Internally limited

Operating junction temperature, TA

(3)

–40

°C

Maximum operating junction Temperature, TJ

150

°C

Storage temperature range, Tstg

–65

150

°C

Human body model

ESD rating(4)

Charge device model

Machine model

200

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the

maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package

in the application (

θJA), as given by the following equation: TA(max)= TJ(max)–(θJA X PD(max)). To achieve optimum performance, it is

recommended to operate the device with a maximum junction temperature of 105

°C.

(4)

The human body model is a 100-pF capacitor discharged through a 1.5-k

Ω resistor into each pin. The machine model is a 200-pF

capacitor discharged directly into each pin.

DISSIPATION RATINGS

(1)

POWER RATING

DERATING FACTOR

PACKAGE

RθJA

(2)

RθJB

(2)

TA ≤ 25°C

ABOVE TA = 25°C

YFF

105

°C/W

950 mW

8 mW/

°C

(1)

Maximum power dissipation is a function of TJ(max), θJA and TA. The maximum allowable power dissipation at any allowable ambient

temperature is PD = [TJ(max) – TA] / θJA.

(2)

This thermal data is measured with high-K board (4 layers board according to JESD51-7 JEDEC standard).

TPS62650 bảng dữ liệu(PDF) 2 Page - Texas Instruments

TPS62650 bảng dữ liệu(HTML) 2 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39

bảng dữ liệu tải về

Link URL